Injection Molding
Reaction Injection Molding enabling the encapsulation of electronics for comfort and design
NO MORE HARDCASES
Enabling Softer Solutions
Upgrade your product offering with our patented reaction injection molding process that can create 3D contoured performance foam components for use across a variety of applications, from impact protection to the encapsulation of electronics. This process is carried out at lower temperatures, allowing us to utilize thermally sensitive fabrics and integrate electronic components. Additionally, this technology is more sustainable than traditional molding techniques, generating up to 96% less landfill waste.
Platform Features
Our Foam
Applications
Workplace safety, impact protection for the elderly and athletes, and encased sensing solutions for biopotential and biometric monitoring.
Platform Capabilities
Low temperature and pressure formulation of foam and padding technology for impact protection and the encasing of electronics.
Technology Specification
Capability
Technology Embedded
+ Patented Reaction Injection Molding (RIM) technology
+ Ability to mold Polyurethane foam, TPU Film, Fabric (Nylon/Polyester/Elastane blends)
TECHNOLOGY WOVEN IN
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Textile Engineering
Integrated Technologies
Advanced Material