Textile Circuitry
Integrating technology in a seamless,
invisible manner
ELEVATING PRODUCT APPLICATIONS
Invisible and Seamless
Our solutions in textile circuitry offer a range of novel capabilities allowing for a new generation of devices that are soft, stretchable and anatomically compliant, and withstanding high tensile stress associated with on-body applications.
Platform Features
Seamless
Design freedom without sacrificing performance or comfort.
Safe
Ensures safety and withstands mechanical stresses.
Machine Washable
Machine washable systems.
Conductive Pathways
Being the backbone of textile circuitry, conductive pathways offer the means to connect power and data. Available on multiple different configurations (16+ variants) to suit different applications.
+ Conductive Coated Wires
+ Conductive Yarn
+ Printed Pathways
+ Sewable Pathways
+ Embroidered Pathways
Interconnections
Techniques that have been developed to connect both external and embedded electronic accessories to textile circuitries
+ Conductive Adhesives
+ Bar Tacking
+ Rivets
+ Snaps: Magnetic or Mechanical
+ Crimp Pins
+ FPC FFC Connectors
Conductive Inlays
The capability of incorporating flexible wires, tubes, and active elements to the fabric by using the knitting process to present the technology in a seamless, invisible manner
+ Smart garments
+ Heating
+ Data transferring
+ Lighting ( optical fiber, LED yarns)
+ NFC + RFID (In yarn level)
+ Sensor in yarn level
Encapsulation
Capability of incorporating flexible wires, tubes and active elements to the fabric by using knitting process to present the technology in a seamless, invisible manner
+ PastiDip
+ Silicone
+ Liquid PU
+ PU Tapes
+ Neoprene + Fabric
OUR TEXTILE CIRCUITRY
Applications
Embedding Intelligence through textile circuitry.
Interconnections
+ For Durability and withstanding mechanical stresses
+ No data loss with negligible resistance in connection
+ Machine washable
Allows for:
+ From sensor interfaces to conductive pathways to control unit
+ Between textile circuitries at different locations
+ From textile circuitries to batteries
Conductive Inlays
+ Ubiquitous and invisible integration with less material handling
+Automated process (No separate insertion) with time/cost savings
+ Connected Clothing
+ Varied technology integration capability : Heating, Data transferring, Lighting ( optical fiber, LED yarns), NFC + RFID (In yarn level), Sensor
+ Built in at yarn level
TECHNOLOGY WOVEN IN
Explore All Platforms
Textile Engineering
Integrated Technologies
Advanced Material